Meldin® 7001 Polyimide Replacing Vespel® SP-1 in Semiconductor Applications
Meldin® 7001 polyimide is replacing Vespel® SP-1 in an expanding number of semiconductor applications including Wafer Processing, Handling and IC Testing components. Meldin provides a combination of high-performance properties and superior economical performance.
Meldin® 7001 is ideal for electrical and thermal insulating applications. In Semiconductor Wafer Processing applications, the plasma etch rate of Meldin® 7001 is lower than Vespel® SP-1 providing superior performance over time. In IC Test Sockets & Probe Test Heads, Meldin® 7001 has replaced more expensive Vespel® SP-1 while meeting the same performance standards for precision micro-drilling and long-term stability.
Meldin® 7001 products feature operational temperatures of 500ºF (260ºF) for continuous operation and 900ºF for intermittent exposure, and tight tolerances of ±0.001 in. on both ODs and IDs. Meldin 7001 is suitable for high-temperature structural, high-purity semiconductor components.
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Meldin® 7001 Features & Benefits:
* Ultra Clean (High-Purity)
* Low Outgassing
* Low Dielectric Properties
* Easy To Machine & Very Stable
* Does Not Melt
PROFESSIONAL PLASTICS, INC. - Global Supplier of Polyimide Shapes
USA Customers, call (888) 995-7767, or e-mail us at firstname.lastname@example.org
Asia Customers, call +(65) 6266-6193
All others, call (858) 637-2801
Main E-Mail: email@example.comAsia E-Mail: firstname.lastname@example.org
Meldin® is a registered trade name of Saint Gobain Performance Products and is distributed by Professional Plastics in the United States and Southeast Asia. Vespel® is a registered trade name of E.I. DuPont DeNemours.
Statements are based on typical properties and customer feedback, as well as, manufacturer provided descriptions and technical data. This information should not be considered as the sole basis of material specification. Customers should approve materials based on first-hand experience in each application. Professional Plastics supplies this information without liability and makes no statement of responsibility regarding the suitability of this or any other material in a specific application.